Update F9.1 screenshots and terms to match current GUI
Clarify symbol naming for symbols with multiple manufactureres with different package suffixes (S2.1)
Added more details on silk-to-pad clearance (F5.1)
Specified that thermal pads with vias need a bottom copper pad (F4.4)
Expanded details for selecting pin length (S4.1)
Minor edits for style, wording, and grammar
Document rules for overlapping/duplicate graphic elements (new rule F5.4)
Correct Pin length definition for staggered TO (image in F3.5)
Document rules for handling oval holes (new rule F7.7)
Document circular hole suffix (F2.1)
Document suffix for multi unit parts (S2.1)
Document clearance requirement between exposed pads and normal pads (F6.3)
Remove inverse 45-degree direction for connectors. (image in F3.6)
Clarify footprint filter rules. Especially regarding exposed pads. (S5.2)
Better wording for pin stack requirements (S4.3)
Include suggestion for exposed pad size in pad requirements rules (F6.3)
Fix TabUp suffix writing style (image in F3.5)
Correct pin layout field description for connectors with different pins per row (F3.6).
Clarify fab layer text sizes and placements to fit current library state (F5.2)
Clearer language for 3d model settings of footprints. (F9.3)
Clarify active low pins in symbols (S4.7).
Clarify footprint naming and pin numbers for parts with shield or mounting pins.
Allow the use of rounded rectangle pads for marking pin 1 in THT parts.
Remove mentions of ThermalPad(s) suffix from all rules. (The only thermals related suffix is ThermalVias)
Clarification of fontsize requirements for symbol fields (S3.2)
Specify solderpaste coverage for exposed pads
extended S5.2 to explain pin-count in FPFilters
Clarification/Correction of NC-pin rules
Clarification of courtyard clearance.
Fix examples in connector naming convention
Fix naming convention for tantal caps
move size code towards the back to avoid impression that these are manufacturer specific
Allow pin name offset values less than 20mils (
Layout field in BGA packages to have prefix
Body size must be first parameter for BGA packages
Added allowance for
+ character in filenames
Added allowance for
, character in filenames
KLC moved from GitHub wiki to KiCad website
KLC rules organized into logical groups, rather than single sequential set of rule numbers
Complete reorganization of the rules as per the above change
Each KLC rule now has its own page, allowing for better descriptions
Most rules have been overhauled and significantly improved
Old KLC revision can be found on the (deprecated) kicad-library Wiki page.