KLC Revision History


3.0.20 - 2019-06-30

  • Update F9.1 screenshots and terms to match current GUI

3.0.19 - 2019-06-19

  • Clarify symbol naming for symbols with multiple manufactureres with different package suffixes (S2.1)

  • Added more details on silk-to-pad clearance (F5.1)

  • Specified that thermal pads with vias need a bottom copper pad (F4.4)

  • Expanded details for selecting pin length (S4.1)

  • Minor edits for style, wording, and grammar

3.0.18 - 2019-02-15

  • Document rules for overlapping/duplicate graphic elements (new rule F5.4)

3.0.17 - 2018-12-31

  • Correct Pin length definition for staggered TO (image in F3.5)

  • Document rules for handling oval holes (new rule F7.7)

  • Document circular hole suffix (F2.1)

  • Document suffix for multi unit parts (S2.1)

  • Document clearance requirement between exposed pads and normal pads (F6.3)

3.0.16 - 2018-12-22

  • Remove inverse 45-degree direction for connectors. (image in F3.6)

  • Clarify footprint filter rules. Especially regarding exposed pads. (S5.2)

  • Better wording for pin stack requirements (S4.3)

  • Include suggestion for exposed pad size in pad requirements rules (F6.3)

  • Fix TabUp suffix writing style (image in F3.5)

3.0.15 - 2018-12-21

  • Correct pin layout field description for connectors with different pins per row (F3.6).

  • Clarify fab layer text sizes and placements to fit current library state (F5.2)

  • Clearer language for 3d model settings of footprints. (F9.3)

3.0.14 - 2018-09-16

  • Clarify active low pins in symbols (S4.7).

3.0.13 - 2018-08-17

  • Clarify footprint naming and pin numbers for parts with shield or mounting pins.

3.0.12 - 2018-08-17

  • Allow the use of rounded rectangle pads for marking pin 1 in THT parts.

3.0.11 - 2018-01-25

  • Remove mentions of ThermalPad(s) suffix from all rules. (The only thermals related suffix is ThermalVias)

3.0.10 - 2018-01-24

  • Clarification of fontsize requirements for symbol fields (S3.2)

3.0.9 - 2018-01-19

  • Specify solderpaste coverage for exposed pads

3.0.8 - 2018-01-02

  • extended S5.2 to explain pin-count in FPFilters

3.0.7 - 2017-12-29

  • Clarification/Correction of NC-pin rules

3.0.6 - 2017-12-05

  • Clarification of courtyard clearance.

3.0.5 - 2017-12-05

  • Fix examples in connector naming convention

3.0.4 - 2017-11-30

  • Fix naming convention for tantal caps

    • move size code towards the back to avoid impression that these are manufacturer specific

3.0.3 - 2017-11-14

  • Allow pin name offset values less than 20mils (mustshould)

3.0.2 - 2017-11-10

  • Require Layout field in BGA packages to have prefix

  • Body size must be first parameter for BGA packages

3.0.1 - 2017-11-08

  • Added allowance for + character in filenames

  • Added allowance for , character in filenames

3.0.0 - 2017-10-22

  • KLC moved from GitHub wiki to KiCad website

  • KLC rules organized into logical groups, rather than single sequential set of rule numbers

  • Complete reorganization of the rules as per the above change

  • Each KLC rule now has its own page, allowing for better descriptions

  • Most rules have been overhauled and significantly improved

Older Revisions

Old KLC revision can be found on the (deprecated) kicad-library Wiki page.